5 th-Generation R-Car SoC Offers Future-Proof Multi-Domain Compute Solutions for Centralized E/E Architecture with Chiplet Extensions MUNICH & TOKYO--(BUSINESS WIRE)-- Renesas Electronics Corporation ...
TOKYO, Japan--(BUSINESS WIRE)--Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the launch of a virtual development environment that ...
SHANGHAI--(BUSINESS WIRE)--VeriSilicon (688521.SH), a leading Silicon Platform as a Service (SiPaaS ®) company, today announced its chip design process has obtained ISO 26262 automotive functional ...
New CV3-AD685 System-on-Chip advances Autonomous and Advanced Driver Assistance System (ADAS) applications, providing single-chip solution for multi-sensor fusion and path planning Integrated ...
New off-the-shelf, cloud-based, digital twin offering, PAVE360 Automotive, empowers automakers and suppliers to begin full-system development on day one, reducing setup time from months to days ...
Developing the electrical/electronic (E/E) systems in automobiles and other vehicles has always been challenging due to the rough environmental conditions experienced on the road and the high ...
The partnership will focus on the development of automotive-grade sensor ICs. Credit: Left: Theo Brunner, Continental Automotive, Head of Electronic Purchasing, Right: Yun Sheng, NOVOSENSE Co-Founder ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results