Cadence设计系统公司宣布，利用最新的系统封装(SiP)和IC封装软件，封装设计者将在芯片封装协同设计过程中和整个半导体设计链中担当更重要的角色。 Cadence设计系统公司宣布，利用最新的系统封装(SiP)和IC封装软件，封装设计者将在芯片封装协同设计过程中和 ...

Allegro X AI 可自动执行 PCB 布局设计和小至中型 PCB 布线设计，将物理布局布线和分析用时从数天缩短至几分钟 中国上海，2023 年 4 月 7 日 —— 楷登电子（美国 Cadence 公司，NASDAQ：CDNS）今日宣布推出 Cadence® Allegro® X AI technology，这是 Cadence 新一代系统设计 ...

Allegro X AI 技术利用云端的扩展性来实现物理设计自动化，在提供 PCB 生成式设计的同时，还可确保设计在电气方面准确无误，并可用于制造。这项新技术可自动执行器件摆放、金属镀覆和关键网络布线，并集成了快速信号完整性和电源完整性分析功能。

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the Cadence ® Allegro ® X AI technology, a next-generation system design technology that offers ...

Allegro X Platform Offers Unparalleled Integration and Technology Across Multiple Engineering Domains, Delivering Up to 4X Productivity Improvements over Traditional Design Tools SAN JOSE, Calif. -- ...

Cadence Design Systems CDNS has unveiled the Cadence Allegro X AI technology, a new system design tool that offers significant improvements in performance and automation. Traditionally, PCB design's ...

Join our daily and weekly newsletters for the latest updates and exclusive content on industry-leading AI coverage. Learn More Cadence Design Systems announced the Cadence Allegro X AI technology to ...

Cadence Design Systems has announced the Allegro X AI technology, a next-generation system design technology that delivers both performance improvements and automation. The AI offering is built on and ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the new Cadence ® OrCAD ® X Platform, a cloud-enabled system design solution that offers transformative ...

SAN JOSE, Calif.– Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the new Cadence® OrCAD® X Platform, a cloud-enabled system design solution that offers transformative improvements in ease ...