是德科技（Keysight Technologies, Inc.）推出电气结构测试仪（EST），这是一款用于半导体制造的键合线（Wire Bonding）检测解决方案，确保电子组件的完整性和可靠性。 半导体行业面临着因芯片密度增加而带来的测试挑战，这些芯片应用于医疗设备和汽车系统等关键 ...

Wire bonding, a critical yet often overlooked process in electronics manufacturing, plays an indispensable role in shaping the devices we rely on today. A programmable semi-automatic ultrasonic wire ...

Copper wire bonding is an essential interconnection technology in microelectronic packaging, offering a cost-effective alternative to gold while delivering superior electrical and thermal ...

This ball-bonder type wire-bonding machine makes delicate welds at breakneck speeds. It requires many of the same stage and controller capabilities as automated IC programmers, PCB assemblers, FPD and ...

SINGAPORE--(BUSINESS WIRE)--Kulicke & Soffa Industries, Inc. (NASDAQ: KLIC) (“Kulicke & Soffa”, “K&S” or the “Company”), a global leader in the design and manufacture of semiconductor, LED and ...

The wire bonding market is anticipated to witness continued growth due to the demand from several end-use industries such as aerospace & defense, consumer electronics, healthcare, automotive, and ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Adeia Inc. (Nasdaq: ADEA), the company whose patented innovations enable high performance computing, edge sensing and AI solutions, today announced that Hamamatsu ...