Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

PSD@5KM+ expands ecosystem with co-working and talent development; 2nd batch of tech collaborators onboarded to expand IC ...

The landscape of IC design is experiencing a profound transformation. With the physical and economic limits of conventional two-dimensional scaling, the industry is rapidly embracing three-dimensional ...

获奖理由： 东芯半导体股份有限公司在2024年10月至2025年10月所取得的成就如下 （1） 公司销售额 2025年半导体设计行业景气度回升，网络通信、消费电子等下游市场需求有所回暖，公司积极把握市场机遇，加大市场拓展力度，有效推动了产品销售。公司持续布局 ...

Traditional verification methods are proving inadequate for addressing critical reliability challenges in today’s increasingly complex integrated circuit (IC ...

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

The AI revolution is driving change in how we design and manufacture everything from data centers to servers and chips. Even what we consider a chip is changing from the integration of analog circuits ...

In the burgeoning Low-Earth Orbit (LEO) satellite market, Taiwanese manufacturers have traditionally found their niche in subcontracting component assembly and antenna integration, rather than carving ...

As the complexity of IC designs continues to grow, moving critical checks earlier in the design cycle helps designers identify and resolve issues before they escalate, streamlining the overall ...

How advanced IC designs are replacing board-level systems. How an eFPGA can empower a system’s design. Designers continue to face greater challenges in the development of advanced embedded systems.

In one instance, to further enhance output voltage swing and linearity, the authors propose a novel “breakdown-voltage (BV) ...

The government has long provided research and development subsidies to share the risks of innovation among manufacturers, a key strategy driving Taiwan's industry. As many as 53 companies... Tuesday 9 ...