A new technical paper titled “Hybrid surface pre-treatments for enhancing copper-to-copper direct bonding” was published by ...

Make large-scale simulations smarter and faster, up to 300X faster in some cases, for an improved return on software, hardware, human resources, and other investments.

Design AI infrastructure that scales efficiently from cloud to edge while staying adaptable for future innovation.

The small and complicated features of TSVs give rise to different defect types. Defects can form during any of the TSV ...

In today’s advanced packages, however, resistance no longer resides primarily inside transistors or neatly bounded test ...

For decades, optical inspection has been the primary method for process control in fabs. However, the move to multi-level ...

Patterns created using advanced fault models provide higher test coverage, improved defect detection, and higher-yielding ...

Researchers from Fudan University designed a fiber integrated circuit (FIC) with a multilayered spiral architecture. The ...

Researchers from Rice University, University of Utah and National University of Singapore (NUS) published “Three-dimensional ...

Information Flow Verification at the Pre-silicon Stage Utilizing Static-Formal Methodology.” Abstract “Modern system-on-chips (SoCs) are becoming prone to numerous security vulnerabilities due to ...

The shift to multi-die assemblies is forcing changes in how chips are tested and inspected in order to achieve sufficient yield ramp or respond more quickly to yield excursions.

The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.