A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.
Abstract: This paper developed a photonically actuated ultrawideband, two-dimensional transmit array using a Fourier optical lens as a beamformer. Data encoding was developed, in which custom IF ...
It seems like only yesterday we covered a project using QR codes to archive data on paper (OK, it was last Thursday), so here’s another way to do it, this time with a dedicated codec using the full ...
[Chuck Hellebuyck] wanted to clone some model car raceway track and realised that by scanning the profile section of the track with a flatbed scanner and post-processing in Tinkercad, a useable ...
Department of Chemistry, University of Washington, Seattle, Washington 98195, United States ...
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