Our Next Generation Microelectronics Manufacturing (NGMM) program is about more than leapfrogging today’s chips through 3D heterogeneous integration (3DHI). It’s also about establishing a national resource: a self-sustaining U.S. 3DHI manufacturing center that will serve government, industry, and academia for years to come. Join us at the NGMM Summit on October 27-28 in Austin, Texas, to see how this enduring ecosystem is taking shape. Learn more and register today: https://web.cvent.com/event/a

Airbus, ASML, Ericsson, others in 8.1 billion euro EU microelectronics projects

Huge CHIPS Act grant goes to ASU-led defense microelectronics hub

Thermal and Failure Analysis of Advanced Microelectronic Devices

Master's degree in Semiconductor Engineering and Microelectronic Design - UPC Universitat Politècnica de Catalunya